Dr Gunter Erfurt, CTO – Meyer Burger | Topic: Next Generation High Power Solar Cell and High Energy Yield Module Technology Achieving Lowest Manufacturing Cost and LCOE Levels
Photovoltaics continue contributing significantly to the global energy mix. Levelized cost of electricity (LCOE) is one of the primary metrics for the cost of electricity produced by both utility scale and distributed power systems. The fastest path to lower LCOE is to introduce high efficiency and high energy yield solar cell and module concepts like the bi-facial heterojunction technology (HJT) and passivated contacts as upgrade to existing PERC lines that can be perfectly combined with Meyer Burger’s newest smart-wire connection technology (SWCT). Meyer Burger’s heterojunction technology allows the manufacturing of solar cells averaging 23.5% at OPEX levels <$3.5ct/Wp. Wafer thicknesses can be reduced <140 µm as cut.
Furthermore and to support also the evolutionary improvement of existing PERC lines, Meyer Burger developed a production solution to manufacture PERC cells with passivated contact on the rear side (“TOPCON”) reaching also levels of >22.5% efficiency. Both technologies can perfectly be integrated into SmartWire Connection Technology (SWCT) busbarless modules. Those exhibit best energy yields and provide the best cosmetic appearance available in the market.
Meyer Burger develops solar technologies – from wafers to complete PV systems. The company is ready to supply bankable volume production solutions for growing n-Type/HJT and n- and p-type passivated contacts market with tools, complete lines as well as professional factory planning and technology partnership.
* High light yield and outstanding passivation properties thanks to amorphous silicon for HJT
* The finished HJT solar cell has a low temperature coefficient
* Efficiencies in excess of 24% are possible, today average is 23.5%
* High HJT bifaciality up to 93% efficiency on the rear side.
* Lower HJT production costs thanks to the low temperature process and fewer manufacturing steps
* Further HJT cost reduction potential thanks for thin wafer compatibility